AXF382700｜B02
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| Product Number | AXF382700 |
|---|---|
| Product Number | AXF382700 |
| Details | Socket |
| Product Name | B02 |
| Features | Low 0.7 mm profile, high current capacity ( 10 A ) , 4 signal pins |
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Spec Detail
| Item | Specifications |
|---|---|
| Part Number | AXF382700 |
| Product Number | AXF382700 |
| Product details | Socket |
| Connector Type | BOARD-TO-FPC |
| Piece Type | 2 Pieces type (Socket) |
| Socket/Header | Socket |
| Applications | Smartphones, Tablet PCs, Mobile devices |
| Number of pins | 8 |
| Mated height (mm) | 0.7mm |
| Packing style | EMBOSSED TAPE AND PLASTIC REEL |
| Packing Inner carton | 15,000 pieces (1-reel) |
| Packing Outer carton | 30,000 pieces |
| Soldering terminals | with |
| Positioning bosses | without |
| Body length (L mm) | 4.85 |
| Body Height (H mm) | 0.69 |
| Short width (mm) | 2.20 |
| Recommended PC board pattern Width (mm) | 2.60 |
| Rated current | 5.0A/pin contact (Power terminal) 0.3A/pin contact (Signal terminal) |
| Dielectric strength | 150V AC for 1min. |
| Insulation resistance (Min. MΩ) (Initial) | 1000 |
| Contact resistance (Max.mΩ) | Power terminal: Max. 16mΩ Signal terminal: Max. 90mΩ |
| Soldering heat resistance | The initial specification must be satisfied electrically and mechanically |
| Insertion and removal life (times) | Mechanical life: 30 times Contact resistance: Power terminal: Max. 16mΩ Signal terminal: Max. 90mΩ Composite removal force: Min. 7N |
| Molded portion material | LCP resin (UL94V-0) |
| Contact and Post Material | Copper alloy |
| Surface treatment material | Base: Ni plating Surface: Au plating |
The other side
| Part Number | Product Number | Product | Details | Mated height | Product name | |
|---|---|---|---|---|---|---|
 | AXF482700 | - | Header | 0.7mm | B02 |
